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High-frequency wiring board - List of Manufacturers, Suppliers, Companies and Products

High-frequency wiring board Product List

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Dynamic Map "Millimeter Wave Wiring Circuit Board"

Dynamic Map "Millimeter Wave Wiring Circuit Board"

Patent research materials related to millimeter-wave wiring circuit boards.

We offer a dynamic map titled "Millimeter Wave Wiring Circuit Board," which focuses on wiring board technology that supports millimeter wave and terahertz wave transmission, as well as related materials and electronic component technologies. This dynamic map utilizes recent domestic public patent information, where technical experts conduct patent research and classification to track the activities of companies and research institutions working on 6G. It visualizes the movements of technology based on patent information, providing an overview of the advanced patent environment. [Related Materials] ■ Dynamic Map "Post 5G - 6G Low Dielectric and Low Loss Materials" ■ Dynamic Map "6G and Transmission Lines" ■ Dynamic Map "Metamaterial Application Development" ■ Patent Guidebook "Information and Communication Series" ■ Invention Derivation Guidebook "Information and Communication Series" *For more details, please download the PDF or feel free to contact us.

  • Patent/Copyright related services

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Design and manufacturing of high-frequency substrates capable of heat management.

Design and manufacturing of high-frequency substrates capable of heat management.

For applications requiring heat dissipation measures and heat resistance. Compatible with various materials such as copper and ceramics.

Our company specializes in the design and manufacturing of high-frequency substrates that meet various needs such as "high thermal conductivity," "high strength," and "miniaturization." In applications where heat dissipation measures are particularly required, such as high-speed wireless communication, we can design to conduct heat from heat-generating components to copper-based substrates via through-holes rather than through insulation layers. [Proposal Examples] ■ High thermal conductivity 　→ Copper-based fluoropolymer substrates ■ Low loss & high thermal conductivity 　→ DPC substrates (ceramic wiring substrates using plating methods) ■ Miniaturization (RF section, control section separation) 　→ Bonding of fluoropolymer substrates and FR-4 substrates *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Circuit board design and manufacturing

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